lead-free parts pb la46b/dbkug-7-pf led array ligitek electronics co.,ltd. property of ligitek only data sheet doc. no : qw0905-la46b/dbkug-7-pf rev. : a date : 04 - may- 2006
1.anode green 2.common cathode 3.anode blue 1.anode green 2.common cathode 3.anode blue dbk 1 + 2 - ug 3 + ligitek electronics co.,ltd. property of ligitek only 7.1 7.25 0.5 0.5 typ 9.5 6.3 0.5 page 1/6 package dimensions 3 12 2.54typ 7.6 7.6 part no. la46b/dbkug-7-pf 3.8 0.5 2.54typ ug 3 2 1 dbk ldbkug3392 1.5 max 1 2 3 2.54typ 2.0min 0.5 typ 7.6 10.5 0.5 8.6 2.54typ 2.0min 18.0min 5.0 5.9 note : 1.all dimension are in millimeter tolerance is 0.25mm unless otherwise noted. 2.specifications are subject to change without notice.
white diffused color lens ingan/gan material la46b/dbkug-7-pf part no blue emitted 220 luminous intensity @20ma(mcd) typ. 30 spectral halfwidth nm 470 dominant wave length dnm 4.0 max. forward voltage @ ma(v) 3.5 typ. 20 120 min. viewing angle 2 1/2 (deg) 70 2/6 page ligitek electronics co.,ltd. property of ligitek only unit ma ma a v mw 30 100 dbk ratings 50 150 ir -20 ~ +80 -30 ~ +100 120 forward current peak forward current duty 1/10@10khz parameter operating temperature storage temperature electrostatic discharge( * ) reverse current @5v power dissipation typical electrical & optical characteristics (ta=25 ) symbol esd t opr tstg i f pd i fp absolute maximum ratings at ta=25 note : 1.the forward voltage data did not including 0.1v testing tolerance. 2. the luminous intensity data did not including 15% testing tolerance. static electricity or power surge will damage the led. use of a conductive wrist band or anti-electrosatic glove is recommended when handing these led. all devices, equipment and machinery must be properly grounded. * part no. la46b/dbkug-7-pf ug 30 120 100 10 2000 algainp green 574 20---2.612022070 min. --- 1.7
fig.5 relative intensity vs. wavelength typical electro-optical characteristics curve ligitek electronics co.,ltd. property of ligitek only 1.03.04.0 0 1 1.0 r e l a t i v e i n t e n s i t y @ 2 0 m a wavelength (nm) 450 0.0 400500550 0.5 0.5 r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z e @ 2 5 20 ambient temperature( ) ambient temperature( ) 0 -20 -40 0.8 0 -40-20 100 80 60 40 20 0.0 60100 80 40 fig.4 relative intensity vs. temperature 2.5 1.0 0.9 1.1 1.5 1.0 2.0 fig.3 forward voltage vs. temperature 1.2 3.0 r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a f o r w a r d c u r r e n t ( m a ) forward current(ma) forward voltage(v) 2.05.0110 0.0 0.5 1.0 1.5 2.0 1001000 fig.2 relative intensity vs. forward current fig.1 forward current vs. forward voltage 2.5 3.0 1 10 100 1000 dbk chip page3/6 part no. la46b/dbkug-7-pf
4/6 page 5.0 4.0100 10 1.0 forward current(ma) 1000 3.0 2.0 r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a 1000 ug chip 10 1.0 0.1 1.0 f o r w a r d c u r r e n t ( m a ) 100 forward voltage(v) fig.1 forward current vs. forward voltagefig.2 relative intensity vs. forward current ligitek electronics co.,ltd. property of ligitek only 0.0 0.5 1.0 1.5 2.0 2.5 3.0 typical electro-optical characteristics curve 80 4060 0 -40-20 ambient temperature( ) 20100 80100 4060 020 r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 1.2 0.9 1.0 1.1 -20 0.8 -40 1.0 f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z e @ 2 5 fig.3 forward voltage vs. temperature fig.5 relative intensity vs. wavelength ambient temperature( ) 650 600 550 0.5 0.0 500 wavelength (nm) r e l a t i v e i n t e n s i t y @ 2 0 m a fig.4 relative intensity vs. temperature 2.0 0.0 0.5 1.0 1.5 2.5 3.0 part no. la46b/dbkug-7-pf
ligitek electronics co.,ltd. property of ligitek only 2.wave soldering profile soldering condition(pb-free) 1.iron: soldering iron:30w max temperature 350 c max soldering time:3 seconds max(one time) distance:2mm min(from solder joint to case) page 5/6 260 c3sec max 5 /sec max temp( c) 260 0 2 /sec max 60 seconds max 0 preheat 100 50 150 time(sec) 25 120 dip soldering preheat: 120 c max preheat time: 60seconds max ramp-up 2 c/sec(max) ramp-down:-5 c/sec(max) solder bath:260 c max dipping time:3 seconds max distance:2mm min(from solder joint to case) part no. la46b/dbkug-7-pf
ligitek electronics co.,ltd. property of ligitek only page 6/6 reference standard description jis c 7021: b-12 the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. mil-std-883:1008 jis c 7021: b-10 the purpose of this is the resistance of the device which is laid under condition of high temperature for hours. mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 this test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. test item reliability test: operating life test low temperature storage test high temperature storage test 1.ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs) 1.ta=105 5 2.t=1000 hrs (-24hrs, +72hrs) 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, +72hrs) test condition mil-std-202:103b jis c 7021: b-11 the purpose of this test is the resistance of the device under tropical for hours. mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 this test intended to see soldering well performed or not. mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. 1.ta=65 5 2.rh=90%~95% 3.t=240hrs 2hrs high temperature high humidity test thermal shock test solder resistance test solderability test 1.t.sol=260 5 2.dwell time= 10 1sec. 1.t.sol=230 5 2.dwell time=5 1sec 1.ta=105 5 &-40 5 (10min) (10min) 2.total 10 cycles part no. la46b/dbkug-7-pf
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